Explanation

It is the carrier of integrated circuit packaging, which can provide power connection, protection, support, heat dissipation, assembly and other functions for chips to achieve multi pin, reduce the size of packaged products, improve electrical performance and heat dissipation, ultra-high density or multi chip modularization. The packaging substrates is produced with the advent of ball grid array packaging (BGA), chip size packaging (CSP) and other advanced packaging forms.

Classification