Explanation

It is also called photoresistance. It generally refers to a class of auxiliary materials for photolithography in the manufacturing process of integrated circuits, semiconductor discrete devices, display devices, etc. photoresist is usually composed of photosensitive resin matrix, sensitizer, crosslinking agent and solvent. According to the different chemical structures and spectral absorption characteristics of photosensitive resin and sensitizer, photoresist can be divided into UV photoresist, deep UV photoresist, electron beam photoresist, X-ray photoresist and other different types. After being irradiated by a specific light source, chemical reaction occurs in the exposed area of photoresist, which makes its solubility change significantly. After being treated with developer, the soluble part is removed, so as to obtain the circuit diagram required by i. According to different photochemical reaction mechanisms, photoresist can be divided into negative photoresist and positive photoresist. After exposure, the negative photoresist is crosslinking in the light part to form insoluble substances; On the contrary, the positive photoresist is the soluble material formed by degradation reaction in the exposed area.

Classification