Explanation
The purity of copper bonding wire is more than 99.99%, the diameter is generally 18-50pm, and the wire is wound on a standard metal spool with a length of 500m, 1000m, 2000m or 3000m; copper bonding wire has higher strength and stiffness, better electrical and mechanical properties, and slower growth rate of imermetallif compound than bonded alloy wire Especially, it has lower materials cost than gold wire, and becomes a substitute for gold and glod alloy bonding wire in the field of packaging with low requirements.
Classification
No classification at present.