Explanation
It is mainly used for bonding the electrode on the silicon wafer of the integrated circuit semiconductor device and the leads frame, called gold and glod alloy bonding wire. The purity of spherical weld gold wire must be greater than 99.999%. 99.999% Au can form a perfectly spherical shape, but the bonding strength is not good. Adding trace elements can improve its strength. But it will have different effects on the shape of the gold wire into a ball, so the amount of added elements is very small. Try to ensure high purity, and its purity must be greater than 99.99%.
Classification
Information materials -> Auxiliary materials -> Others