Explanation
The method of physically transferring the source material into the gas phase and forming a covering layer on the substrate. It is usually carried out in vacuum. There are four working modes: ① vacuum deposition, such as vacuum evaporation, molecular beam epitaxy, ion beam deposition, ion cluster deposition, laser evaporation; ② sputtering deposition, such as radio frequency sputtering, magnetron sputtering, ion beam sputtering; ③ Plasma enhanced deposition, such as biased activation or conditioning reactive evaporation, hollow cathode discharge ion plating, cathodic arc deposition, magnetron sputtering ion plating: ④ ion beam enhanced deposition, such as ion beam enhanced magnetron sputtering, ion beam enhanced ion team deposition.
Classification
No classification at present.