Explanation

materials containing pure metal powder for making thick film resistors. The only puremetallicresistancepaste that has been applied recently is copper resistance paste m. Silicon of copper electrothermal slurry is sintering in nitrogen. The peak temperature is 900 ° C. The sintering time fi? 8 minutes. The oxygen content in nitrogen is (6-8) X10. The stability of copper resistors is very good. In order to enable the copper resistance paste to be sintering in air, the nj adopts a copper boron glass system. Pass the copper powder and boron powder through a W0 mesh sieve, with an average particle size of less than 4Mm. After being prepared in a certain proportion, it is mixed with alcohol, ball milled, dried through a 400 mesh sieve, and added to an organic carrier to make a slurry. Burn in air at 700T for 10 minutes. When the formula is copper powder 77.6%, boron powder 8.8% and glass 13.6%, its square resistance is 20kfL copper resistance paste for making thick film resistance components.

Classification