Explanation
magnetron sputtering is a kind of physical vapor deposition (PVD). The general sputtering method can be used to prepare metal, semiconductor, insulator and other multi materials, and has the advantages of simple equipment, easy control, large coating area and strong adhesion. The magnetron sputtering method developed in the 1970s has realized high speed, low temperature and low damage. Because high-speed sputtering is carried out at low pressure, the ionization rate of gas must be effectively improved. magnetron sputtering increases the sputtering rate by introducing a magnetic field on the surface of the target cathode and using the magnetic field to restrict the charged particles to increase the plasma density.
Classification
No classification at present.